Full Automatic Glue Dispensing Machine Production range:450x450mm PCB width:400mm Weight:1000KG Dimension:921x1230x1499mm Product description: Full Automatic Glue Dispensing Machine, Glue Dispenser, Production range:450x450mm, PCB width:400mm,
New Equipment | Coating Equipment
Can be customized online or offline according to customer requirements Advantage characteristics Mechanized production instead of the traditional manual dispensing. Mature three-axis mechanism to make the device more accurate and stable position
VPI Solid Vinyl ESD control tile and conductive epoxy adhesive are components of a precision-engineered system of static control tile. Conductile (static-conductive) vinyl tile contains encapsulated conductive elements of the carbon family that are
VPI ESD control vinyl tile and conductive epoxy adhesive are components of a precision-engineered system of static control tile. Statmate (static-dissipative) vinyl tile contains encapsulated conductive elements of the carbon family that are distrib
New Equipment | Coating Equipment
Our silver conductive fabric is coated silver on the fabric,the fabric have good shielding and sterilization efficiency,so it can be used to radiation protection maternity dress, electromagnetism protection clothes,shielding curtain,ect. China EMI Sh
High temperature adhesives, ceramics, epoxies, conductive adhesives, sealants, encapsulants, insulation products, specialty materials, etc.
Industry Directory | Manufacturer
StaticWorx manufactures ESD Flooring, Conductive Tile, SDT, Static Dissipative Carpet, Anti Static Epoxy, Rubber, Carpet Tile and Conductive Vinyl ESD Floors
Industry Directory | Manufacturer's Representative
we export soft electromagnetic shielding materials
New Equipment | Coating Materials
Our silver conductive fabric is coated silver on the fabric,the fabric have good shielding and sterilization efficiency,so it can be used to radiation protection maternity dress, electromagnetism protection clothes,shielding curtain,ect. China EMI Sh
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
