Electronics Forum | Thu Dec 07 07:36:15 EST 2006 | callckq
Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder paste is with SAC type. I already checked, the solder paste Cu is just 0.5%..Hence, I am guessing that copper migration is from PCB pad. No way it is fr
Electronics Forum | Fri Jun 16 10:23:40 EDT 2006 | pms
Thanks Davef, We recommend ENIG to our customers at this time, we have not had any customers reporting issues with it so far. I like the protection of the nickle from copper dissolution during wave in a PB free scenerio, but the "Black-Pad" issue i
Electronics Forum | Fri Mar 14 11:04:54 EDT 2008 | herman
Samir, To correct some misconceptions on the answers to your question, and "what you know from experience": With both ENIG (Electroless Nickel/Immersion Gold-IAu) and IAg (immersion silver), soldering does not take place to the gold or the silver. Wh
Electronics Forum | Thu Oct 07 08:13:52 EDT 2010 | remullis
I just swapped from the HASL to Immersion Silver mainly because the board house we use could not maintain consistency in keeping the pads level. I was constantly battling bumps and bad finishes on the pads. They are able to give me a consistent board
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
Electronics Forum | Fri Apr 23 14:27:22 EDT 2010 | hegemon
I am concerned about a 'tarnishing' effect after moisture bake out that affects solderability on a batch of PCBs. This finish is new to us,and I am wondering if anyone has ideas about how to drive the moisture out of the boards without compromising
winsouce.jpg)
