Full Site - : silver immersion pad lift (Page 7 of 11)

Low Silver Solder Problems

Electronics Forum | Sat Aug 22 15:12:32 EDT 2009 | rossi

Thank you for replying. 1) the finish is Gold Immersion (ENIG) 2) paste type EM907 SN96.5/AG3.0/CU0.5 3) it is always the same BGA but its not on the same ball every time. It is always at the joint on the PCB pad like the solder is not sticking prope

Immersion Silver - surface problems (need experienced help)

Electronics Forum | Mon Aug 24 17:58:10 EDT 2015 | warwolf

We have had some test results come back after we were getting poor wetting in our joints, we requested an EDS on our joints from our PCB supplier. They have provided the results and said that it was their fault and will replace. What I want to know

Immersion Ag

Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef

We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition

Re: Detecting lifted leads on QFPs

Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F

| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect

PbF PCB finish

Electronics Forum | Wed Jan 24 10:08:36 EST 2007 | electronhose

Immersion Silver, ImAg, is becoming the finish of preference. This is due to it having similar process limits vs. SnPb HASL. There were some early concerns about shelf life, but new chemistries have extended finish shelf life to 12 months+. Many boar

Tombstone/ Poor welting

Electronics Forum | Thu Feb 21 03:25:58 EST 2008 | jlawson

I have seen smt chip varistors with Pd/Ag teminations that had poor wetting in terms of good fillet in LF (sac305) soldering. We found that the solder tended to be attracted to the plating on the part and off the actual pad (silver Immersion). This c

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

PCB Surface finish

Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz

Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l

lead pull out issue

Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose

recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u

lead pull out issue

Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose

Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl


silver immersion pad lift searches for Companies, Equipment, Machines, Suppliers & Information

Solder Paste Dispensing

High Resolution Fast Speed Industrial Cameras.
Sell Used SMT & Test Equipment

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Voidless Reflow Soldering

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications


"回流焊炉"