Electronics Forum | Tue Sep 14 14:07:45 EDT 2010 | grahamcooper22
Hi Gani, HASL is normally very good for solderability providing there is a good consistent coating of HASL on the pcb pad. But it is not unusual to have a very thin coating of HASL on the pad and this is poor for solderability. You then have tin/copp
Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman
If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere
Electronics Forum | Tue Dec 21 11:49:33 EST 2010 | remullis
1st the buyer shouldn't control the process based on cost. Let them buy stuff and stick to that. 2nd, I do think leveling in th HASL process is important. If you have high spots on pads for fine pitch your wiping away more of that aperture than othe
Electronics Forum | Wed Aug 12 22:18:42 EDT 2020 | stephendo
Almost all the people here buy boards with the metal already plated on. We are mostly assembly people. The ones you really want to talk to are PCB fab people. And if you want to look into plating PCBs, I would suggest you look up Black Pad. It hasn'
Electronics Forum | Thu Mar 08 12:40:54 EST 2001 | Ralph Merk
We are currently using 0402 resistors and capacitors in our production process. Our equipment is as follows: - DEK 265 - Siemens S25/F5 - Vitronics XPM520(5 zones) - 2% silver solder Alpha WS678 The problem is that randomly some 0402 capacitors are
Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger
Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t
Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel
If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Mon Jul 28 08:54:52 EDT 2003 | davef
You are 100% correctomundo about ENIG. When it's good it's good, BUT when it's bad, you just want something else. You know you have black pad, when you see parts falling from the board. First, there is not perfect solderability protection. Second
