Full Site - : silver palladium 2-lead (Page 4 of 11)

Ceramic subtrate with silver/palladium surface finish

Electronics Forum | Sat Jul 24 01:52:31 EDT 2004 | C.W

thanks Dave!!

Re: Tombstoning 0805s w/palladium/platinum/silver terminations

Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle

| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi

Green inductors

Electronics Forum | Mon Feb 20 08:25:13 EST 2006 | Rob

No problem. If you get no joy you're going to have to change the footprint to a 1206 or 1210. Murata have a range of high Q value inductors (50-60) & from memory Toko used to be pretty hot too. The terminations on the coilcraft part are listed a

When do you use Tin/Lead/Silver paste ?

Electronics Forum | Wed Feb 20 09:38:47 EST 2002 | davef

Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc re: "Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ?" No Several points are: * Component leads with silver in the sol

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Curious PCB technology

Electronics Forum | Mon Jan 27 10:09:33 EST 2020 | charliedci

Looks like a screen printed circuit using a platinum or palladium silver paste. This would account for the grainy appearance. I 've seen this on a white ceramic substrate but not on aluminum. Any components are attached using a silver conductive epox

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut


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