Electronics Forum | Thu Jan 12 17:35:34 EST 2006 | russ
We use immersion Silver for all of our lead free PCBs. They come in the "silver saver" paper you speak of and we have found that they will tarnish after 7 days in the open enviroment. Even with this tarnish we experienced no reflow problems. We are
Electronics Forum | Thu Apr 02 08:26:36 EST 1998 | Steve Gregory
| Yes, norm it is. Look back to February 98 :discussion on this issue. Norm, That discussion does deal with palladium coated leads, but when I read your statement about silver/palladium fired terminations, I'm assuming that you're referring to
Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Sat Jul 31 08:14:43 EDT 2004 | sforman1
Your liquidus time is too long. 63/37 is a eutectic so leave at liquid state a very short time SF
Electronics Forum | Tue Aug 24 14:01:12 EDT 2004 | davef
Indy: How is this situation different than the last time you posted: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=29371
Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef
We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.
Electronics Forum | Mon Feb 18 07:57:38 EST 2008 | davef
Silver palladium is intended for adhesive applications. You need components with a nickel barrier. While you're waiting for others to reply, search the fine SMTnet Archives [ar and pd] to find postings like http://www.smtnet.com/forums/Index.cfm?CFAp
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Thu Mar 25 13:53:28 EST 1999 | Bob Willis
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
