Full Site - : silver palladium 2-lead (Page 8 of 11)

TOMBSTONE DEFECTS

Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto

Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v

Epoxy Cracked & Capacitor Cracked

Electronics Forum | Wed Sep 09 21:20:26 EDT 1998 | Simon Ting

hi, 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of epoxy,

Re: Epoxy Cracked & Capacitor Cracked

Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon

| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e

PCB Gold Pad Corrosion.

Electronics Forum | Thu Apr 20 14:59:11 EDT 2017 | davef

It's difficult to tell anything from your picture. But playing the odds, I'd say it's not "gold corrosion." It is very difficult to corrode gold. Gold is a NOBLE metal. From Wikipedia, the free encyclopedia In chemistry, the noble metals are metals

PCB Solder Finish Survey

Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis

PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy

Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information

Re: Alternate surface finishes

Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon

| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW

Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p

Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford

AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no

Re: Tin-Lead thickness on PWB's

Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon

.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in


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