Full Site - : silver palladium platinum (Page 6 of 11)

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut

Re: Tin/Silver solder paste fillets

Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F

Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut

Tombstone/ Poor welting

Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti

Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou

Immersion Palladium Surface Finish

Electronics Forum | Thu Jan 12 17:35:34 EST 2006 | russ

We use immersion Silver for all of our lead free PCBs. They come in the "silver saver" paper you speak of and we have found that they will tarnish after 7 days in the open enviroment. Even with this tarnish we experienced no reflow problems. We are

Immersion Silver Reliability

Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken

ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.

Ceramic subtrate with silver/palladium surface finish

Electronics Forum | Sat Jul 31 08:14:43 EDT 2004 | sforman1

Your liquidus time is too long. 63/37 is a eutectic so leave at liquid state a very short time SF

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 14:01:12 EDT 2004 | davef

Indy: How is this situation different than the last time you posted: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=29371

electrically conductive adhesives

Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef

We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.


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