Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Thu Mar 25 13:53:28 EST 1999 | Bob Willis
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon
| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest
Electronics Forum | Thu Jun 27 08:48:08 EDT 2002 | yngwie
I was approached by the comp. suplier to change the capacitors that I currently used. No change in elect. charateristic, but only on : a) change of palladium to nickel base inner electrode b) outer electrode material i.e. from silver to copper. Que
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue May 23 09:50:37 EDT 2006 | flipit
They work well in silver conductive epoxy in hybrid applications. They are very poor in no clean applications. They don't work that well in OA solder paste either. Used them once in OA paste and in a nitrogen. They looked just fine. Solder to Pd
Electronics Forum | Thu Jan 25 13:20:17 EST 2007 | slthomas
Are you running a lead free process? If not, have you identified these as lead free components? If so, have you increased the temps in your profile to accomodate that? After that, I'd look for a AgPd (silver/palladium) or some other such PITA platin
Electronics Forum | Tue Oct 23 07:03:52 EDT 2007 | davef
We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means the component lead is much warmer than the pad on the board. This is the direction we would have taken this if we hadn't taken the AgPd / conductive e
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