Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
At Barry: custom requests are common and welcome. We enjoy the challange. Extensive capabilities, wide material selection and state-of-the-art equiptment (including in-house plating and machining) ensure we can deliver a component fitting your exact
New Equipment | Test Equipment
Highly Accurate, Full Precious Metal Analysis The QSX-295T was developed with over twenty years of experience working with jewelers from New York City to Los Angeles. The analyzer offers a simple to operate solution for highly accurate identificati
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Thu Aug 12 20:32:44 EDT 2004 | usdigital
Indy, We use Palladium silver surface finish parts for silver epoxy attached parts only. It is our understanding that this finish is not for solder, but only silver epoxy attach. I expect that is you problem. Dave
Industry News | 2018-10-18 08:46:25.0
"Lead-Free" Semiconductor Industry
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
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Parts & Supplies | Pick and Place/Feeders
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Parts & Supplies | Pick and Place/Feeders
CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/750/760/2010/2020/2030/2040/2050/2060/2070/2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/JX-100 laser unit),YAMAHA laser,SAMSUNG laser,TENRYU laser,PHILIPS(ASSEMBLEON) FCM PPU laser,Autotronik
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Two stations, one for soldring and the another is for goods loading at the same time. So it doubled the production efficiency
Ruichi Standard Soldering Robot R351. Soldering Tip can be designed according to your products.
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
Iron / Alloy42 Nickel Silver Palladium Platinum Silver Solder Plated Stainless Steel Tin Titanium Non-solderable Zinc Flux Types Recommended Use RMA Rosin mildly activated Recommended RA Rosin activated Wets clean surfaces NC No clean Alloy specific (contact EFD
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
today’s lead-free soldering applications. A series of soldering dissolution experiments, modeled on Bader’s, were conducted using SAC305 solder with gold, silver, palladium, platinum, copper and nickel samples
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