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Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2024-04-08 15:46:36.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

New Yorker Electronics Unveils New CIT Relay & Switch Process Sealed Snap-Action Switches

Industry News | 2021-03-03 14:17:42.0

New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress

New Yorker Electronics

Barry Industries Introduces 500W RF Termination for High Power DC-4.5GHz Applications

Industry News | 2016-01-05 13:57:47.0

Barry Industries announces the introduction of a RoHS-compliant flange mount RF termination, T50R0-500-15X, which dissipates 500W with favorable return loss over a DC to 4.5GHz bandwidth. Barry Industries is an ISO9001:2008 certified ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.

Barry Industries, Inc.

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB

Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB

New Equipment | Components

Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB Quik Details: Product Name: Solar Panel Rigid PCB Base Material: FR4 Epoxy Resin Bare Board Size: 120mm x155mm Surface Finishing: Leaded HASL PCB Material Flamming rate: 94

Agile Circuit Co., Ltd

8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication

8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication

New Equipment | Fabrication Services

8 Layers Printed Circuit Boards Manufacturing Multilayer PCB Fabrication Product Name: Multilayer PCB Board Material: FR4 Copper thickness 1 oz all layers Board Thickness: 1.6mm Special requirement Impendence Control Fab by Circuit Boar

Agile Circuit Co., Ltd

AO610 3BHT300008R1 | ABB | Analog Output

AO610 3BHT300008R1 | ABB | Analog Output

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 ​​​ yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

New Yorker Electronics Announces Release of New CIT Relay Ultra Subminiature Switch

Industry News | 2023-04-04 14:43:55.0

CIT's new DM3 Series of Ultra Subminiature Switches are available in Four Different Actuator Types

New Yorker Electronics


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