Full Site - : silver plated terminals tarnish (Page 5 of 8)

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.

Terminal plating

Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef

Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl

Terminal solderability + Silver plating

Electronics Forum | Tue Aug 10 09:26:49 EDT 2004 | davef

You should be able to solder to brass - check with you flux supplier to get their recommendations. The flux you are using may not have enough activation to breakdown the oxides on the brass surface. A word of caution - brass (copper and zinc alloy)

Chip capasitor plating

Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob

Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are

Soldering to Platinum/Silver terminations.

Electronics Forum | Tue Jan 30 12:58:49 EST 2007 | barryg

We are seeing problems with platinum over silver plated part also. Our main problem is solder splatter under these devices, and voiding at the terminations on parts off the reels.I am curious if you have removed any of these parts and noticed any spl

Transient Voltage Suppressors

Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford

AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup

| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.

Re: Soldering to Gold

Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon

| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco


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