New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
New Equipment | Solder Materials
The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper
Can make to different bottle size Speed:800~1200rpm/min(adjustable) sales@jwide-smt.com
High speed mixer, centrifugal mixer 1200RPM More information, welcome to contact: Web: www.obsmt.com E:sales@obsmt.com T/ Wechat/ Whatsapp: +86 13926596436 Skype: xudan0525
Industry News | 2018-09-18 20:11:02.0
Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2019-08-17 11:50:22.0
OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Parts & Supplies | Circuit Board Assembly Products
1). Material CEM-3, FR-1 2). Double sided, 1.6mm, 1oz 3). Silver through hole 4). Green solder mask/white silk screen 5). OSP finish 6). Punch contour/cnc rout
New Equipment | Solder Materials
KappZapp3.5™ is the most popular of the low temperature Silver bearing solders. It melts completely at just 430°F (221°C). This minimizes the heat applied to your sensitive electronic parts and minimizes distortion of thin wire or tabs. Learn more
New Equipment | Solder Materials
Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and
