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AIM Solder Accepts 2013 NPI Award for Its New NC277 VOC-Free Flux at the IPC APEX EXPO

Industry News | 2013-02-21 07:01:08.0

AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux.

AIM Solder

Indium Corporation Introduces Wave Solder Flux for

Industry News | 2004-09-22 14:23:28.0

Indium Corporation of America has introduced Wave Solder Flux 3592-35 specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.

Indium Corporation

SN100C P810 D4 low-voiding lead-free solder paste.

SN100C P810 D4 low-voiding lead-free solder paste.

Videos

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Nihon Superior Co., Ltd.

STI Acquires Fischerscope X-ray XDAL 237

Industry News | 2017-07-19 21:09:38.0

STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.

STI Electronics

Time Temperature setting wave soldering is the most important in the solder melts

Industry News | 2018-10-18 09:27:40.0

Time Temperature setting wave soldering is the most important in the solder melts

Flason Electronic Co.,limited

Nihon Superior USA Exhibits SN100C at IPC International Conference on Flexible Circuits 2008

Industry News | 2008-02-15 15:45:43.0

OSAKA, JAPAN � February 13, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it showcased its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the IPC International Conference on Flexible Circuits, that took place February 13, 2008 in Phoenix, Ariz.

Nihon Superior Co., Ltd.

Nihon Superior’s President Tetsuro Nishimura to Present at SMTA Pan Pacific Microelectronics Symposium 2012

Industry News | 2012-01-13 12:58:39.0

Nihon Superior announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.

Nihon Superior Co., Ltd.

TopLine Sponsors IMAPS Wire Bonding Conference

Industry News | 2018-03-13 18:47:01.0

TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

TopLine Dummy Components

Saelig Introduces Quick-Setup -100dB Attenuation RF/EMI Tabletop Enclosures

Industry News | 2020-05-28 10:52:31.0

SFI High Attenuation Frameless Enclosures are compact, easy to setup and tear down, and offer excellent EMI isolation on the benchtop

Saelig Co. Inc.

AIM’s NC275LR VOC-Free Flux Passes New SIR Requirements

Industry News | 2012-05-21 13:23:06.0

NC275LR is really leading-edge technology for VOC-free fluxes.

AIM Solder


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