Electronics Forum | Thu Jul 22 20:41:11 EDT 2004 | C.W
hi All, i have recently running a Ceramic board with silver/palladium surface finish, using Alpha Metal 63/37 WS solder paste, soldering meet IPC standard after reflow, however, the solder joint look grainy, not sure if there could be too much interm
Electronics Forum | Sat Jul 24 01:52:31 EDT 2004 | C.W
thanks Dave!!
Electronics Forum | Mon Feb 20 08:25:13 EST 2006 | Rob
No problem. If you get no joy you're going to have to change the footprint to a 1206 or 1210. Murata have a range of high Q value inductors (50-60) & from memory Toko used to be pretty hot too. The terminations on the coilcraft part are listed a
Electronics Forum | Tue May 23 02:29:41 EDT 2006 | Loco
No suggestions, but we've also had problems with silver palladium. No wetting on reflow, when we tried handsoldering them, we could actually scrape off the whole finish and were left with a black unsolderable underground. It was just 1 reel, seems
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti
Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou
Electronics Forum | Sat Jul 31 08:14:43 EDT 2004 | sforman1
Your liquidus time is too long. 63/37 is a eutectic so leave at liquid state a very short time SF
Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef
We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.
Electronics Forum | Mon Feb 18 07:57:38 EST 2008 | davef
Silver palladium is intended for adhesive applications. You need components with a nickel barrier. While you're waiting for others to reply, search the fine SMTnet Archives [ar and pd] to find postings like http://www.smtnet.com/forums/Index.cfm?CFAp
Electronics Forum | Thu Jan 25 13:20:17 EST 2007 | slthomas
Are you running a lead free process? If not, have you identified these as lead free components? If so, have you increased the temps in your profile to accomodate that? After that, I'd look for a AgPd (silver/palladium) or some other such PITA platin
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