Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Industry News | 2013-12-04 09:24:54.0
SMTA announced that the Early Bird Registration Deadline for the 19th Annual Pan Pacific Microelectronics Symposium is January 8, 2014.
Industry News | 2014-05-13 14:03:06.0
The SMTA has issued a call for papers for the 2014 Pan Pacific Microelectronics Symposium, which will be held 3 - 5 February 2015 on Kauai, Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly.
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2001-02-05 19:38:36.0
The IPC Designers Council has announced it will sponsor a Designer Learning Symposium on July 16-21, 2001 at the Hilton Hotel in Northbrook, IL. This first time-event will concentrate primarily on practical, hands-on training for designers.
Industry News | 2020-06-24 15:24:05.0
The Surface Mount Technology Association (SMTA) today announced that its annual conference and exhibition, SMTA International, will proceed for 2020 as a completely virtual event starting September 28, 2020.
Industry News | 2021-02-08 15:08:49.0
IPC announces the release of IPC-2551, International Standard for Digital Twins. Thisfirst international standard is comprised of digital twin product, manufacturing, and lifecycle frameworks. Using this standard, any manufacturer, design organization or solution provider can initiate application interoperability to create smart value chains.
Industry News | 2012-10-04 20:07:30.0
— IPC — Association Connecting Electronics Industries® will host a new event in India focused on expanding electronics manufacturing expertise.
Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
