Industry News | 2010-05-11 15:19:01.0
The IPC APEX EXPO™ 2010 Conference and Exhibition marked its 10 year anniversary with a sizable increase in overall attendance numbers up by 10% over last year. The SIEMENS booth surpassed all expectations with a 50% increase in visitors compared to the previous year.
Industry News | 2009-05-06 14:51:50.0
The presentations of technology leader Siemens Electronics Assembly Systems (SEAS) at regional trade shows like APEX in Las Vegas, Nepcon in Shanghai and SMY/Hybrid/Packaging in Nuremberg, Germany confirm that the company has set the right course for the future.
Industry News | 2010-05-11 15:26:44.0
SIPLACE can add two more major awards to its trophy cabinet for the SIPLACE SX-Series. At the Nepcon Shanghai 2010 trade show in China the SIPLACE team was honored with the EM Innovation Award and the SMT China Vision Award.
Industry News | 2009-11-30 08:18:56.0
Live Gantry Upgrade Demonstrations Continue to Draw Industry Attention
Industry News | 2009-10-15 08:43:05.0
Live Gantry Upgrade Demonstrations Prove SIPLACE Strength in Innovation
Industry News | 2010-05-04 08:04:45.0
After the highly successful introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany (June 6-8, 2010; Hall 7, Booth 204).
Industry News | 2010-04-28 11:15:51.0
SIPLACE SX wins two more awards and receives excellent feedback
Industry News | 2010-02-04 07:00:32.0
Over 200 visitors experienced live gantry upgrade demonstrations
Used SMT Equipment | Chipshooters / Chip Mounters
ASM Siemens Siplace X4 Placement Machine (2008) Year of manufacture: 2010Serial number: B1123-12038725PCB transport: dual-lane conveyorStation s/w ver.: 708.2SP3Vision ver.: 532.3.2Gantry 1Placement head: C&P20 Component camera: SST23#11;Board camera
Used SMT Equipment | Chipshooters / Chip Mounters
The SIPLACE TX placement modules are the new standard in high-volume production. No other placement solution features this level of precision (22 µm at 3 sigma) and speed (up to 78,000 cph) in such a tiny footprint (only 1 m x 2.3 m). For the first t
