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NEW: AutoSIR2 + and AutoCAF2+ Optimising Test Flexibility

Industry News | 2018-12-13 10:32:16.0

SIR and CAF testing have become significant demands by the industry in the drive to improve and enhance electronic circuit reliability.

Gen3 Systems

Save the Date and Mark Your Calendars

Industry News | 2020-03-12 06:20:11.0

STI's Mark McMeen, VP, Engineering Services, will have a special presentation on How does one collect "Objective Evidence" to meet the new J-STD-001 Section 8.1 on electronic assembly cleanliness? The presentation take place at STI Electronics Inc.'s facility in Madison, AL on March 26, 2020 at 3 p.m. and will explore why this IPC standard came about and why the current "ROSE" test methodology is not enough for today's advanced designs. It will explore different tools and techniques as well as discuss how to gather objective evidence needed to meet the specification. There will be an actual demonstration of the equipment and test reports that are generated by the SIR test equipment along with the actual hardware that generates the test data that supports "Objective Evidence" for review. Do you know how "clean or dirty" your electronic manufacturing process and resulting hardware/assemblies are at completion?

STI Electronics

Gen3 Systems Marks 30 Years as a Provider of Solderability, SIR, CAF and Cleanliness Testing

Industry News | 2015-03-05 10:32:22.0

Gen3 Systems Limited is pleased to announce the company’s 30th anniversary. Since 1985, Gen3 Systems has been providing training and comprehensive in-house services for solderability, SIR, CAF and cleanliness testing.

Gen3 Systems

Kester Launches SELECT-10™ Selective Solder Flux

Industry News | 2016-04-22 10:20:35.0

Kester is proud to announce the launch of SELECT-10™Selective Solder Flux, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. As part of Kester’s portfolio of high reliability products, SELECT-10™ has passed IPC SIR testing as a raw and partially activated flux. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10™ is classified as ROL0 flux under IPC J-STD-004B.

Kester

PCBA Cleanliness End-of-Project Webinar

Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,

PCBA Cleanliness End-of-Project Webinar

iNEMI (International Electronics Manufacturing Initiative)

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Technical Library | 2017-08-17 12:23:27.0

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.

Indium Corporation

New NPL Method for Testing Reliability of Electronics in Condensing Environment FREE Webinar

Industry News | 2016-09-06 12:39:58.0

NPL have developed a new test method to control the rate of condensation on to printed board assemblies during environmental testing like SIR or conformal coating assessment

ASKbobwillis.com

How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR?

Technical Library | 2016-09-08 16:27:49.0

In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.

Foresite Inc.

Lead-Free Solder Fluxes

Lead-Free Solder Fluxes

New Equipment | Solder Materials

To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporati

DKL Metals Ltd

Horizon Sales is pleased with sales activity as Gen3 product line builds momentum in North America

Industry News | 2020-03-08 16:58:46.0

Horizon Sales is pleased to announce that their initial efforts as the exclusive North American distributor for the Gen3 product line have kicked off tremendously. Since the start of their relationship with Gen3 at the beginning of 2020, Horizon has equipped their Brighton, Michigan demo room with several Gen3 products, and accomplished multiple customer visits to see the machines in action. Some Gen3 products that have been extremely popular with their customer base are the Gensonic stencil cleaning system, the AutoSIR and the MUST3 solderability tester.

Horizon Sales


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