Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
Industry News | 2009-02-06 02:51:30.0
LOS ALAMITOS, CA � February 2009 � Practical Components Inc., the leading supplier of dummy components, announces that the new Practical Components B-52 CRET (Cleanliness & Residue Evaluation Test) Kit is designed to help determine the ionic cleanliness of a customer's manufacturing process. The test boards and components follow guidelines associated with the IPC-B-52 Test Vehicle.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Industry News | 2023-01-30 15:49:02.0
Magnalytix, providing real-time reliability solutions for electronics manufacturing, received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Functional Test for its MAGNALYTIX® OE-300 Surface Insulation Resistance (SIR) Testing System. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
Industry News | 2018-12-13 10:32:16.0
SIR and CAF testing have become significant demands by the industry in the drive to improve and enhance electronic circuit reliability.
Industry News | 2020-03-12 06:20:11.0
STI's Mark McMeen, VP, Engineering Services, will have a special presentation on How does one collect "Objective Evidence" to meet the new J-STD-001 Section 8.1 on electronic assembly cleanliness? The presentation take place at STI Electronics Inc.'s facility in Madison, AL on March 26, 2020 at 3 p.m. and will explore why this IPC standard came about and why the current "ROSE" test methodology is not enough for today's advanced designs. It will explore different tools and techniques as well as discuss how to gather objective evidence needed to meet the specification. There will be an actual demonstration of the equipment and test reports that are generated by the SIR test equipment along with the actual hardware that generates the test data that supports "Objective Evidence" for review. Do you know how "clean or dirty" your electronic manufacturing process and resulting hardware/assemblies are at completion?
Industry News | 2015-03-05 10:32:22.0
Gen3 Systems Limited is pleased to announce the company’s 30th anniversary. Since 1985, Gen3 Systems has been providing training and comprehensive in-house services for solderability, SIR, CAF and cleanliness testing.
Industry News | 2023-02-06 14:28:28.0
Gen3 will exhibit at Southern Manufacturing & Electronics 2023, scheduled to take place Feb. 7-9, 2023 at the Farnborough International Exhibition Centre. The company will showcase the AutoSIR2+™ Surface Insulation Resistance Testing System and a new CM+ Series demo unit in Stand L90. Additionally, AOI systems from MEK Europe BV will be on display.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
