Electronics Forum | Wed Mar 07 07:21:08 EST 2007 | jdengler
We window pane the heat sink pad to reduce the amount of paste for DPACK component
Electronics Forum | Wed Dec 07 13:46:45 EST 2011 | cyber_wolf
When was the last time the backlight bulbs in the head were replaced ?
Electronics Forum | Mon Dec 12 13:29:18 EST 2011 | cyber_wolf
Just click on my name and you should be able to message me.
Electronics Forum | Fri Aug 02 01:54:24 EDT 2019 | ameenullakhan
Hi All, Any method to check any vibration in reflow oven. Regards, Ameen
Electronics Forum | Thu Aug 08 22:35:49 EDT 2019 | sssamw
What is the skewed part ? How you exclude other causes?
Electronics Forum | Sun Apr 11 13:48:33 EDT 2021 | ngumado28898
Hi guys, I'm a newbie for SMT field. Currently, I'm facing a problem that there were many defects such as tombstone, missing, skewed, billboarding that happened with 1 type component (Resistor 0201) with a specific supplier X (we have many supplier b
Electronics Forum | Fri Jul 06 09:39:18 EDT 2001 | johnw
Hi guys I am having problems with skewed placement of 0402 devices I would like to add the board has raised pads and we are placing on glue. We are now printing the glue rather that dispensing with a GL5. have any of you guys had this pro
Electronics Forum | Thu Oct 19 16:12:59 EDT 2006 | sliebl
Our machines can't use 'cad data' for fids. I'm intimately familiar with these machines as I've been using them for 11 years. Most likely, it's a limitation of our machines/software, whereby it requires symetrical local fids. When we place a PCB on t
Electronics Forum | Thu Jun 22 12:06:10 EDT 2000 | Wolfgang Busko
Hi Sal, I assume your homeplates are designed with the peaks towards the componentcenter. I can imagine that due to placement inaccuracy not both sides sit in the same amount of paste and that wetting difficulties prevent same force factors for both
