Used SMT Equipment | SMT Equipment
Model :KE-760 Mounter Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Used SMT Equipment | SMT Equipment
Model :KE-2010 Mounter Placement speed：11000CPH Max PCB size :KE2010M,330mm/250mm；KE2010L,410mm/360mm；KE2010E,510mm/460mm Station:80 Component range :8mm-72mm Strip, bulk material Placement accuracy: CHIP ±0.08mm Power supply:three-phase 220V~3
Used SMT Equipment | SMT Equipment
Model :KE-2050 Mounter Placement speed：13, 200CPH(0.27sec/chip) Component mount range:0.6x0.3mm~□20mm or 26.5x11mm Station:80 Power supply:3P/200~415V/3KVA Size:1,500x1, 500x2, 000mm Weight:1,400kg
Used SMT Equipment | SMT Equipment
Model :KE-2060 Mounter Placement speed：Chips:12, 500CPH(0.288sec/chip) Ics:1,850CPH(1.9sec/IC) Component mount range:0.6x0.3mm~□74mm or 50x150mm Station:80 Power supply:3P/200~415V/3KVA Size:1,730x1, 600x2, 000mm Weight:1,410kg
Used SMT Equipment | SMT Equipment
Model :FX-2/FX-2C Mounter Pick and Place Machine Placement speed：Chips:40000CPH*2(0.09sec/chip) Component mount range:0402 chips ~33.5mm Station:80 Power supply:3-phase AC200~415V 4KVA/12KVA Size:1880*1731*1490mm Weight:2100kg
Parts & Supplies | Chipshooters / Chip Mounters
Product name: YG200 YAMAHA medium speedchip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop:
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Used SMT Equipment | SMT Equipment
Product Name: Samsung EXCEN-PRO Product number: Samsung EXCEN-PRO Detailed product introduction Samsung EXCEN-PRO high speed chip mounter parameters EXCEN is equipped with 16 suction nozzles, rotary head of the high-speed modular chip mounter, it
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-1 Detailed product introduction FX-1 JUKI chip mounter Model: FX-1R Substrate size: 410*360MM Component height: 6mm Element size: 0603 (0201 inch) laseridentification chip ~20mm component or 26.5*11mm Component mounting spee
.png)
