Technical Library | 2024-04-29 21:39:52.0
In this paper, we develop and put into practice an Automatic Optical Inspection (AOI) system based on machine vision to check the holes on a printed circuit board (PCB). We incorporate the hardware and software. For the hardware part, we combine a PC, the three-axis positioning system, a lighting device and CCD cameras. For the software part, we utilize image registration, image segmentation, drill numbering, drill contrast, and defect displays to achieve this system. Results indicated that an accuracy of 5µm could be achieved in errors of the PCB holes allowing comparisons to be made. This is significant in inspecting the missing, the multi-hole and the incorrect location of the holes. However, previous work only focusses on one or other feature of the holes. Our research is able to assess multiple features: missing holes, incorrectly located holes and excessive holes. Equally, our results could be displayed as a bar chart and target plot. This has not been achieved before. These displays help users analyze the causes of errors and immediately correct the problems. Additionally, this AOI system is valuable for checking a large number of holes and finding out the defective ones on a PCB. Meanwhile, we apply a 0.1mm image resolution which is better than others used in industry. We set a detecting standard based on 2mm diameter of circles to diagnose the quality of the holes within 10 seconds.
Mirae Corporation has released the new MR series pick and place machine for SMT production. The MR series features: - 4th generation linear motor on X and Y gantry - 01005" part placement for long production runs - Z Height measurement - All feeders
How do you ensure operators place the right component in the right place and with the right orientation on the board every time? It’s easy, and it’s what we’ve been helping companies to achieve around the world for almost 30 years. The Robotas Masco
New Equipment | Design Services
PollEx PCB DFM PollEx DFM is rule-based PCB verification software for manufacturing engineers. Using PollEx PCB as its basis PollEx DFM supports PCB design data in various ECAD formats. It allows users to detect design errors which result in costl
Used SMT Equipment | Chipshooters / Chip Mounters
30 intelligent spindle assemblies -> All vision processing is performed “on the fly” to maximize throughput. -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras -> narrow field of view c
There's no room for error in your measurements. That's why National Instruments data acquisition (DAQ) products deliver the accuracy and performance you need. Whether your application is a full-scale production test system, or a low-budget laboratory
Self-contained, three channel capability offers high capacity, low temperature SMT/Thru-Hole soldering and desoldering. Digital readout displays the current channel's temperature information, error codes and programming status.
Career Center | Chino, California USA | Technical Support
The role of the Field Service/applications engineer is to provide professional service and support for Scienscope customers by performing field service installation, startup, repairs and maintenance of x-ray equipment. Typical duties will include b
Career Center | Fremont, California USA | Production
NRC Manufacturing, is a small, tight knit operation looking for a capable and knowledgeable SMT Machine Programmer. Experience and skill are important to us, and we’re looking for someone that can hit the ground running and knows their way arou
Technical Library | 2015-04-02 20:12:58.0
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.