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Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
SMT XTRA is a global electronics specialist, providing productivity enhancing solutions for the global Surface Mount electronic assembly sector.
SOS Inventory Software provides top-of-the-line inventory control, order management, and manufacturing for a wide variety of industries, plus integration with QBO, UPS, ShipStation, Shopify, BigCommerce, Zapier and PayPal.
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Used SMT Equipment | Soldering - Reflow
Reflow welding machine is a very important equipment in SMT production process. Reflow welding process directly affects the quality of SMT process. It is difficult to achieve good reflow welding quality without a good reflow A welding machine. [1]
Used SMT Equipment | Pick and Place/Feeders
With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component
Industry News | 2014-04-11 12:49:57.0
Heller Industries was announced the winner of the Circuits Assembly 2014 Service Excellence Award in the category of Reflow Soldering Companies.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Aug 09 18:30:00 UTC 2020 - Sun Aug 09 18:30:00 UTC 2020 | ,
Monitoring & Bench marking Your Processes and Assembly Yields
Events Calendar | Tue Jul 02 18:30:00 UTC 2024 - Tue Jul 02 18:30:00 UTC 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | South Plainfield, New Jersey USA | Engineering
MacDermid Alpha Electronics Solutions, a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seeking a Jr. Chemical Process Enginee
Career Center | Irvine, California USA | Production
We are looking for a SMT machine operator with 4-5 years experience. If you have Siemens machine experience, it is a plus. You will be in charge of 5 pick and place machines and be required to: -program using CAD Data -set up feeders -screen pri
Career Center | Boise, Idaho USA | Engineering,Research and Development
Sr. Microelectronics Development Engineer Over 20 years experience in SMT Process Development for large Contract Manufacturer. Specialist in Stencil Printing, Component Placement, Dispense, Reflow, Rework, RoHS Processes, Material and Equipment Quali
Career Center | Moscow, Russia | Engineering,Management,Production,Quality Control
04.2011 - continue to work Moscow, - Instrumentation / electronics engineering procurement and contract manufacturing Supply production of components and materials. Placing orders for contract manufacturing of electronic products. Coordination of
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale
| http://etasmt.com/cc?ID=te_news_media,10561&url=_print
. Usually, small-scale economical reflow soldering is performed by a heating tube, and the heating tube has two types of heat sinks and a light rod
| https://www.smtfactory.com/Hot-Air-8-Trays-Electric-Reflow-Convection-Oven-with-High-Quality-pd48530624.html
Reflow Wave Oven Reflow Oven Smd Smt Reflow Soldering Oven Reflow Oven Heating Reflow Oven Mini Smt Reflow Oven Reflow Oven Nitrogen Reflow Oven Desktop Reflow Oven Heating Element Reflow Oven
