New Production Test Solution for Smart Devices
Industry News | 2012-11-16 14:50:20.0
Soldering specialist introduces free smart phone app with fantastic features, topical information and world-wide sales and service information.
Industry News | 2014-06-16 15:14:46.0
The Balver Zinn Group has launched a new mobile Web site for smartphone users as part of its continued commitment to providing a convenient, hassle-free experience.
Industry News | 2022-01-05 08:35:52.0
Following the everyday operating habits of smartphones and tablets, the control units of industrial plants are now equipped with touch screens. The Siemens plant in Amberg is a multiple award-winning location where around 5,000 employees manufacture Simatic and Sirius products for the automation industry using state-of-the-art production technology. This also includes operating and monitoring devices for industrial applications in logistics and mechanical engineering. In line with its claim to be an innovation location, the site decided to install a Scheugenpflug dispensing system to bond Coverlens Sensor Fronts for industrial plant control displays.
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Industry News | 2012-01-07 22:06:29.0
JEDEC Solid State Technology Association announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices.
Industry News | 2012-01-13 13:24:14.0
JEDEC announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices.
Industry News | 2017-02-07 16:05:05.0
With the newest vVision release, Viscom offers an intelligent software solution for mobile devices. This brings even greater versatility to the inspection of electronic assemblies. The user is given an overview of the widest range of key figures from his production process, and can retrieve information about products faster than ever.
Industry News | 2021-03-29 13:48:21.0
Super Fast Chargers can Restart a Phone with a Depleted Battery in 45 Seconds
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
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