Electronics Forum | Tue Oct 12 15:20:44 EDT 1999 | Jim Schultz
I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
Electronics Forum | Mon Dec 28 15:03:14 EST 1998 | Earl Moon
| We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inor
Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian
| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew
I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Mon Jun 14 11:39:29 EDT 1999 | Marshall
| | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from m
Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef
Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
