Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
New Equipment | Test Equipment
Smart Tweezers ST-5S are the newest model in the Smart Tweezers line of handheld LCR-meters. This model will be replacing the previous ST-5 model. Smart Tweezers are a fully automatic, handheld, digital LCR-meter designed specifically for evaluating
Streamtek Electronics provide HiRel SMD Packages. Standard products include SMD-2, SMD-1, SMD-0.5, SMD-0.2, TO263 package, SMD-FP Package and customized packages with similar configuration. These packages are complied with MIL-PRF-19500, MIL-STD-750,
Electronics Forum | Tue Jun 18 03:16:46 EDT 2013 | mun4o
production lot is 4000pcs.About 70% of capacitors are out of tolerance ( +/-20%).There are 3pcs C=10u per PCB, in different location.Samsung capacitors wich we use are 1,5 years old - i checked this information from our supplier " Rutronik ".I have
Electronics Forum | Fri Jun 14 13:47:21 EDT 2013 | rway
Chances are this is not a component failure. First, these are passive components with passive testing on the ICT. He may have guarding issues, but more information is required as has been stated. Are all capacitors with the same P/N failing in dif
Used SMT Equipment | THT Equipment
High temperature, lead-free Solder Fountain used for removal and replacement of through-hole components
Used SMT Equipment | Soldering - Reflow
Vitronics XPM2-1030 Lead-Free Reflow Oven Multiple Units Available. Factory Closure - www.xlineassets.com SMT Line #1 2006 MPM Speedline Accela Screen Printer 2007 Universal Advantis AC-30 4983A 2007 Universal Advantis AC-30 4983A 2016 Bro
Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Parts & Supplies | Pick and Place/Feeders
GIC-F01 FUJI NXT Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of
Parts & Supplies | Pick and Place/Feeders
GIC-Y01 YAMAHA Feeder Calibration JIG It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of de
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
we have many universal gold plus feeders to sell . www.smt-store.com
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/chipquik-smd-16-alloy-for-smd-removal
ChipQuik SMD-16 Alloy for SMD Removal – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
| https://www.wesource.com/electronic-components/gold-count-smd-tape-counter-id-53905-4/22/
Gold-Count SMD Tape Counter ID_53905 (4/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US: 858.693.1991 Home About Us Contact Us Categories AOI Assembleon Machines Assembleon Parts Batch Ovens and Chambers Component Counters/Tapers Component Placers
