Full Site - : smd placement upside down (Page 11 of 13)

SMD Spring Pins Reflow Crooked / Tilted

Electronics Forum | Thu Jan 05 12:28:12 EST 2017 | rgduval

I'd recommend not using them, personally :) The long term reliability of the SMT joint is suspect, IMHO. I had them for an in-house manufactured bed-of-nails test fixture for testing somewhere north of 5000 units....after the first 100, we were rep

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Mon May 24 04:01:10 EDT 1999 | Joe Manzur

John, We are using a well known solder paste, begining with the letter "H". (I don't want to be accused of advertising). Also, we are now using a board inverter. In the early day's however, before we purchased a board inverter, we were having to

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 12:33:36 EDT 1999 | Earl Moon

| | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 15:11:10 EDT 1999 | M Cox

| | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accordin

Re: product changeovers

Electronics Forum | Sat Jul 03 13:49:36 EDT 1999 | JohnW

50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W

| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau

| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph

Re: product changeovers

Electronics Forum | Sat Jul 03 19:24:25 EDT 1999 | JohnW

50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon

| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord

Re: product changeovers

Electronics Forum | Sat Jul 03 18:14:03 EDT 1999 | Earl Moon

50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c


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