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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
BGA repair machine Factory,bga reballing station,bga repair tools ,bga rework station,iphone repair machine
Offering HCT-1200-SV full automatic LED Pick and Place Machine / SMD LED Placement Machine. * Placement rate (optimized) 40,000CPH * 8 placement heads * Maximum PCB size 1200×380mm * Placement accuracy: ±0.05mm * Component range: 0603～5
The Shaped Foil SMD Inductor delivers very high performance in a small, light, low cost package. It have been designed to handle very high DC currents and high AC ripple currents from 60Hz up to 500kHz. These inductors offer exceptional reliability w
Electronics Forum | Fri Jul 24 12:12:52 EDT 1998 | smd
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | | We don't even bother
Electronics Forum | Tue Jul 18 16:40:09 EDT 2006 | dphilbrick
We have a system where when we set up the line to run a job before the first part is placed an auditor verifies we have all the correct parts loaded on the machines in thier correct locations. We then run a first article. The board is inspected to in
Used SMT Equipment | X-Ray Inspection
220X magnification provides excellent viewing of the smallest SMD electrical interconnections. Easy-to-use >220X magnification Excellent imaging quality Flexible board/part handling Multipurpose inspection tool Portable, small 32”x
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace D4i Pick And Place Machine Features: With the SIPLACE D4i, we can provide you with an extremely powerful placement machine with four gantries and four 12-nozzle Collect&Place heads. It is thus a high-speed placement a machine that com
Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Industry News | 2003-03-18 10:12:41.0
The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.
Parts & Supplies | Pick and Place/Feeders
samsung NC12MM Feeder Feature : SAMSUNG SMD SMT Spare Part. Part Name: 12mm NC Type Feeder. Rating:12mm Brand : SAMSUNG Unit : PC(s)
Parts & Supplies | Pick and Place/Feeders
samsung NC12MM Feeder Feature : SAMSUNG SMD SMT Spare Part. Part Name: 12mm NC Type Feeder. Rating:12mm Brand : SAMSUNG Unit : PC(s)
Technical Library | 2023-11-20 18:10:20.0
The electronics production is prone to a multitude of possible failures along the production process. Therefore, the manufacturing process of surface-mounted electronics devices (SMD) includes visual quality inspection processes for defect detection. The detection of certain error patterns like solder voids and head in pillow defects require radioscopic inspection. These high-end inspection machines, like the X-ray inspection, rely on static checking routines, programmed manually by the expert user of the machine, to verify the quality. The utilization of the implicit knowledge of domain expert(s), based on soldering guidelines, allows the evaluation of the quality. The distinctive dependence on the individual qualification significantly influences false call rates of the inbuilt computer vision routines. In this contribution, we present a novel framework for the automatic solder joint classification based on Convolutional Neural Networks (CNN), flexibly reclassifying insufficient X-ray inspection results. We utilize existing deep learning network architectures for a region of interest detection on 2D grayscale images. The comparison with product-related meta-data ensures the presence of relevant areas and results in a subsequent classification based on a CNN. Subsequent data augmentation ensures sufficient input features. The results indicate a significant reduction of the false call rate compared to commercial X-ray machines, combined with reduced product-related optimization iterations.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows: These are the components package specifications. Functions: 1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg
Separate precise SMD thin board, aluminum PCB, for special board , needs customization. If any question, just feel free to contact bella@qy-smt.com and browse Website?https://morel-equipment.com/
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Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
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Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow. Show Details Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/creep-test
LED Materials Semiconductor SMD Shear SMT Solar X-ray Technical Papers - Bondtesting Technical Papers - Materials Testing Technical Papers - X-ray Inspection All Downloads Test Types Service
