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Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments

Technical Library | 2012-11-29 14:23:58.0

1000 units per day) production environment presents challenging technical, logistic and cost obstacles that are usually more complex than those encountered at the inspection (automated optical inspection) and the manufacturing process test step (in-circuit test).

SiFO Technologies

PLC (Programmable Logic Controllers) and HMI (Human-Machine Interface) for Intelligent Factory

Industry News | 2021-11-24 20:10:19.0

The development of "intelligent factory" has put forward a new direction for manufacturers. It is necessary for manufacturers to master the production and marketing process clearly, make production process easier to control, reduce the manual intervention with the production line, collect timely and correct production line data, and make production scheduling and planning more reasonable. All of these are of vital importance to improve competitiveness and productivity of manufacturers.

OKmarts Industrial Parts Mall

Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.

Technical Library | 1999-05-09 12:36:40.0

The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality.

DuPont

Preview for Seica SMT Nuremberg May 16-18, 2017 Booth # 4A-300. In the limelight: Industrial Monitoring and Automation

Industry News | 2017-05-05 12:26:30.0

Seica will be showcasing the new Factory DashBoard solution at the SMT exhibition. The solution has been conceived with a special focus towards energy saving requirements and predictive monitoring of events, in compliance with the principles of Industry 4.0. All systems on the booth will integrate Seica's industrial monitoring hardware, and visitors will be able to see the software and mobile tools that provide 'real time' information to assist plant managers in assessing the status of all the equipment in the plant.

SEICA SpA

Europlacer to Exhibit its new XPii SMT modular pick-and-place system and iineo SMT Platform at NEPCON China 2010

Industry News | 2010-03-10 15:39:10.0

March 2010 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new XPii SMT modular pick-and-place system, along with its award-winning iineo SMT platform in booth 1E03 at the upcoming NEPCON China/EMT China 2010 exhibition and conference scheduled to take place April 20-22, 2010 in Shanghai, PR China.

EUROPLACER

Viscom’s S3088 SPI Will Be Part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-23 16:47:32.0

Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

Viscom AG

The Murray Percival Company Will Offer Live On-Site Demos of Essemtec’s Solder Paste Jetting Technologies and SMD Storage Systems

Industry News | 2015-10-06 19:21:09.0

Essemtec today announced that The Murray Percival Company will hold an open house from Oct 20-22, 2015 at its facility. The Murray Percival Company will offer live on-site demonstrations of new solder paste jetting technologies and fully automated SMD storage systems from Essemtec.

ESSEMTEC AG

Companies Team Up to Reduce Cost of JTAG Boundary Scan For Printed Circuit Board Design and Test

Industry News | 2002-12-07 12:21:44.0

"...powerful combination of high-end boundary scan test functionality at low-end prices.�

Flynn Systems

Carve-out completed successfully: Siemens Electronics Assembly Systems adjusts to market situation; wants to become faster and more flexible

Industry News | 2009-01-30 18:35:31.0

Right on schedule, Siemens Electronics Assembly Systems (SEAS) became operational on January 1, 2009, as a legally separate company within the Siemens technology conglomerate. This step signalled the end of the carve-out process, which started in 2008. At the same time, the Siplace Excellence restructuring program, which was begun in 2007, is entering into a second phase that involves making certain volume-driven adjustments.

Siemens Process Industries and Drives

Christopher Associates Announces Presentations from Industry Expert Chrys Shea at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-22 14:43:18.0

Christopher Associates Inc. announces that Chrys Shea, Consulting Engineer, will give a presentation titled “Troubleshooting the Stencil Printing Process” at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX, and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Christopher Associates Inc.


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