Full Site - : smema and step (Page 63 of 73)

MPM Up2000 and SMEMA

Electronics Forum | Tue Sep 13 07:00:28 EDT 2016 | awhite

Thanks for the reply. When you hit start on the printer, you can see it send the "start cycle (SMEMA)" signal, and it immediately goes to "awaiting board from upstream." This tells me that the printer knows a signal has definitely been sent and rece

MPM Up2000 and SMEMA

Electronics Forum | Wed Sep 14 07:37:56 EDT 2016 | awhite

Thanks for the link, Ive actually always wanted to learn Italian :) Unfortunately, because this has been an issue for about 2 weeks now, I think Ive read almost everything ever written about SMEMA protocol. The process seems so simple, it's killing m

MPM Up2000 and SMEMA

Electronics Forum | Thu Sep 15 06:45:26 EDT 2016 | awhite

Hi Ariss_T, Thanks! I actually did check that...that was one of my first thoughts as well. While in the I/O, I slide a raw board back and forth under the camera/sensor and it acted appropriately. I will definitely update this thread as new informa

Pick and Place tutorials

Electronics Forum | Wed Oct 01 10:20:48 EDT 2003 | caldon

www.smtmag.com has Step-by-step articles written by OEMS...Just type in Step-by-step into the search engine on the website...sit back and enjoy the links. Also, http://www.smtinfocus.com has a brief snip-it as well. You may want to do a search for

SMT optimization and improvement

Electronics Forum | Sun May 28 23:01:31 EDT 2006 | jacksaria

Hello to all, We are encountered many problems/defects in SMT lines.I would like to know your suggestion or recommendation for SMT optimization and improvement. What are the step by step solutions in order to optimized and to improve the printer, pi

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

trough-put and cycle times

Electronics Forum | Mon Apr 08 20:43:58 EDT 2002 | davef

Regardless of the design technology of the board, we use shop floor management software that: * Calculates the period that it takes to assemble a job. Obviously, we enter product-manufacturing information [ie, BOM, material receipt dates, process fl

AOI, Quality and SPC

Electronics Forum | Mon Mar 03 13:18:02 EST 2003 | msivigny

Hello phil, The use of AOI systems give us the opportunity to auto-collect defect information much the way you're using them now. AOI systems become extremely effective when the collected data is used to perform some positive change into the process.

Solder Paste and Stencils

Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG

Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more

Re: Paste-in_hole and CTE

Electronics Forum | Thu Jul 27 21:34:41 EDT 2000 | Dave F

Gary: That's curious. Tell us more about your process steps, temperature profiles, paste, warping of the board without the PIH processing, components, etc


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