Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Tue Oct 06 14:25:51 EDT 2020 | philc
Plenty of 0805 inductors around, up to 470mH, but nothing that is 26mH. Coilcraft do 23.5mH or 29mH - see https://www.coilcraft.com/getmedia/18dd250a-2b92-4f9a-bcee-3624995acc0f/0302cs.pdf Eaton do a 27mH 0805 - see https://www.eaton.com/content/dam
Electronics Forum | Tue Oct 06 14:27:51 EDT 2020 | kylehunter
> Plenty of 0805 inductors around, up to 470mH, but > nothing that is 26mH. Coilcraft do 23.5mH or 29mH > - see > https://www.coilcraft.com/getmedia/18dd250a-2b92-4 > f9a-bcee-3624995acc0f/0302cs.pdf Eaton do a 27mH > 0805 - s
Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w
Electronics Forum | Tue Jan 13 19:16:03 EST 2004 | pjc
Dedicated tooling uses what MPM calls an "H" tower. You mount the board support plate (dedicated tooling) on top of the H tower. If boards are only single-sided SMT, meaning only components on one side, the board support plate is flat with vacuum hol
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Thu Jul 15 14:55:24 EDT 1999 | JohnW
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Tue Aug 31 14:36:41 EDT 1999 | JohnW
| I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under diff
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