Electronics Forum | Wed May 07 20:10:24 EDT 2003 | bayanbaru
I am from the Quality Dept. There is this SMT defect that were root cause to defective feeder that lead to component overturn during feeder indexing. I ask for corrective action from the SMT engineer but apparently there is not much he can do except
Electronics Forum | Tue Aug 12 08:34:31 EDT 2008 | rameshr
hai, in our smt process we are facing the following problem. The Case A tantalum capacitor used in our PCB assembly - during reflow process get shifted, due to which other components nearby that also found missing. what are the causes for this proble
Electronics Forum | Thu Aug 20 11:33:54 EDT 1998 | Kallol Chakraborty
Posted by Kallol Chakraborty on August 20, 1998 at 09:33:52: Hi folks, Is there any reclaiming process for bent leads(mostly QFP). Root cause seems to be handling and packaging. Also like to know if there is any equipment that we could consider for t
Electronics Forum | Tue Jun 23 12:39:58 EDT 1998 | Brian Conner
I am experiencing a wave-soldering problem with a leaded capacitor - too much solder above the board!! The capacitor lead is .020" dia. and the hole size is .038". This only occurs on the negative lead of the component. The capacitor is also axial
Electronics Forum | Tue Jun 23 18:43:23 EDT 1998 | D.Lange
| I am experiencing a wave-soldering problem with a leaded capacitor - too much solder above the board!! The capacitor lead is .020" dia. and the hole size is .038". This only occurs on the negative lead of the component. The capacitor is also axi
Electronics Forum | Tue Jun 23 12:38:55 EDT 1998 | Brian Conner
I am experiencing a wave-soldering problem with a leaded capacitor - too much solder above the board!! The capacitor lead is .020" dia. and the hole size is .038". This only occurs on the negative lead of the component. The capacitor is also axial
Electronics Forum | Fri Jul 21 12:15:52 EDT 2006 | CKH
Hi Folk, every now and then, i would encounter Functional Failure due to BGA ICs. The Testing Tech always conclude that the contact of the BGA to the PCB Pad is poor. The 2D/3D X-ray machine can't detect any of the poor contact on the BGA..... We
Electronics Forum | Fri Oct 22 11:04:29 EDT 2004 | Simon UK
I have experienced this same problem with CECC Type caps, in all sizes. One cause, which may have not been explored is the component may hav been cracked before you placed it 1 in 300? Hmm..I did this on our products that were showning atleast 5 per
Electronics Forum | Sun Apr 11 13:48:33 EDT 2021 | ngumado28898
Hi guys, I'm a newbie for SMT field. Currently, I'm facing a problem that there were many defects such as tombstone, missing, skewed, billboarding that happened with 1 type component (Resistor 0201) with a specific supplier X (we have many supplier b
Electronics Forum | Wed Nov 29 01:09:17 EST 2006 | Guess
I would suggest checking the feeder, MVF and MSR are both turret type and dont have the capability auto pik adjust in y. Y offset pick up would lead to : 1. Over turn component. 2. Missing component. Turret sequence is pick, recognize an
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