Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW
Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar
Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Sun Oct 30 03:55:43 EST 2005 | mika
I apologize for my poor english. First: "Double sided sticky tape" is excellent for various reasons; right/left?. Second: NPI? Don't hesitate, If You feel that a certain machine in Your line cofiguration don't place certain/certain's components on th
Electronics Forum | Wed Nov 29 21:05:33 EST 2000 | Michael Parker
Chris- you did not mention some details regarding your processes and volumes. Are you using SMT, PTH, mixed? Machinery involved (automatic vs. manual). Volumes - same 4-20 assemblies, at what periodic rate? Are you doing R&D prototypes only? High or
Electronics Forum | Wed Oct 27 11:32:57 EDT 1999 | Brian W.
When I evaluated a new glue type, I simply used a shear force tester (Chatillon) to compare the cured strengths of the different glues. I sampled parts of different types; 0805, SOT23, 1206, and various tantalum caps. I analyzed the data based on e
Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch
Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t
Electronics Forum | Fri Oct 02 11:14:10 EDT 1998 | Scott Cook
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Ben, We us
Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan
We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30
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