Industry Directory | Manufacturer
Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
Technical Library | 2015-07-01 16:51:43.0
Aerospace and military companies continue to exercise RoHS exemptions and to intensively research the long term attachment reliability of RoHS compliant solders. Their products require higher vibration, drop/shock performance, and combined-environment reliability than the conventional SAC305 alloy provides. The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. One possible route to improvement of the mechanical and thermo-mechanical properties of solder joints is the use of Pb-free solders with lower process temperatures. Lower temperatures help reduce the possibility of damaging the boards and components, and also may allow for the use of lower Tg board materials which are less prone to pad cratering defects. There are several Sn-Ag-Bi and Sn-Ag-Cu-Bi alloys which melt about 10°C lower than SAC305. The bismuth in these solder compositions not only reduces the melting temperature, but also improves thermo-mechanical behavior. An additional benefit of using Bi-containing solder alloys is the possibility to reduce the propensity to whisker growth
Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m
Technical Library | 2009-03-27 22:22:40.0
The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Technical Library | 2008-02-05 22:48:55.0
This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders. The influence of added elements on the electrical and mechanical properties of solder joints created by these solders between PCB and electronic components were evaluated.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Used SMT Equipment | Soldering - Wave
Electrovert Econopak Plus Lead Free Wave Solder; Model: EPK+ 400/F; SN: MO940811001; Date: 10/1994; 440VAC 3-Phase 32.9 KVA; Full of Indium Sn95.5Ag3.8Cu7 Lead Free Solder; Chip & Lambda Wave; (2) Bottom Side I/R Preheaters; (1) Topside I/R Preheater
New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
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