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ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

Nihon Superior to Participate in SMTA International 2008

Industry News | 2008-08-07 11:19:55.0

OSAKA, JAPAN � August 7, 2008 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the technical conference as well as exhibit at the upcoming SMTA International Conference & Exhibition, scheduled to take place August 17-21, 2008 at Disney's Coronado Springs Resort in Orlando, FL.

Nihon Superior Co., Ltd.

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Industry News | 2011-12-30 23:26:12.0

Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.

Nihon Superior Co., Ltd.

Ersa Ecoselect 350

Ersa Ecoselect 350

Used SMT Equipment | Soldering Equipment/Fluxes

The following Ersa Ecoselect 350 is a lead free selective solder system with various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is curre

X-Line Asset Management

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies

Technical Library | 2015-01-08 17:26:59.0

Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern

Sanmina-SCI

Nihon Superior to Address Key Industry Trends, Concerns at the SMTA Ohio Valley Chapter Meeting

Industry News | 2011-05-16 16:00:12.0

Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.

Nihon Superior Co., Ltd.

Technical Devices NU/ERA 16MP

Technical Devices NU/ERA 16MP

Used SMT Equipment | Soldering - Wave

Technical Devices NU/ERA 16MP (EXCELLENT CONDITION) L and V fingers Internal 9500 spray fluxer dual wave Full of Sn63/Pb37 solder finger cleaner top side tunnel roll out solder pot Like new condition  

TDS

Electrovert Vectra Elite

Used SMT Equipment | Soldering - Wave

Electrovert Vectra Elite solder wave. 480 V /  3-Phase / 55 KVA / 60 Hertz - Computer controlled automatic wave solder system - Factory Lead Free machine - Quick Change Solder Pot INCLUDES (1) leaded Sn 63/PB37 and (1) lead-free SN100C solder P

Assured Technical Service LLC

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Technical Library | 2008-11-20 00:46:10.0

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.

AIM Solder


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