Industry News | 2018-10-18 09:42:39.0
SMT reflow oven process principle and introduction
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2022-04-13 09:49:32.0
Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.
Industry News | 2021-11-22 06:40:32.0
Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.
Industry News | 2022-08-26 09:46:28.0
Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at SMTA International from Oct. 31-Nov. 3 in Minneapolis, Minn.
Industry News | 2010-04-09 21:17:21.0
Five of Indium Corporation's technology experts will present their technical findings at APEX in Las Vegas, Nevada, April 6-9, 2010.
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Parts & Supplies | Pick and Place/Feeders
Supply & repair juki ejector at a lower price: JUKI 750(760) EJECTOR E79117250A0 VP*0749 JUKI 750(760) EJECTOR (E3066700000，PISCO VBH07-46) JUKI 750(760) 4-WAY ELECTROMAGNETIC VALVE PV140507000 VQD1121W-5MO-C4-X8B JUKI 750(760) ELECTROMAGNETIC V
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
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Parts & Supplies | Pick and Place/Feeders
Supply & repair juki ejector at a lower price: JUKI 750(760) EJECTOR E79117250A0 VP*0749 JUKI 750(760) EJECTOR (E3066700000，PISCO VBH07-46) JUKI 750(760) 4-WAY ELECTROMAGNETIC VALVE PV140507000 VQD1121W-5MO-C4-X8B JUKI 750(760) ELEC
Electronics Forum | Mon Nov 19 05:49:44 EST 2001 | Cheng
The BGA solder ball composition is 62/36/2 Sn/Pb/Ag, does any problem exist for the solder joint reliability? And what is the difference on SMTA process between this and the normal 63/37 ball?
