Electronics Forum | Fri Oct 06 09:38:11 EDT 2006 | C.K. the Flip
Here's the BGA voids-reduction profile that I used: http://img323.imageshack.us/my.php?image=profileka0.jpg Keep in mind, this was for Sn/Pb BGA with Sn/Pb solder paste. For your situation, you might want to raise the peak temperatures to at least
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Wed Oct 04 16:24:48 EDT 2006 | russ
try Alpha OM5100 this is a noclean paste that we use and have done the same thing you are now, reflowing pbfree with pb paste, we run to max temp of 230C with this paste and use a straight ramp with no soak profile is about 4 mins long from ambiant
Electronics Forum | Fri Oct 13 06:44:18 EDT 2006 | Matt Kehoe
Solid Solder Deposit may work www.sipad.com mk
Electronics Forum | Wed Oct 04 16:19:54 EDT 2006 | russ
you may want to try a different MFGR of paste, this does help on many occasions. Russ
Electronics Forum | Wed Oct 04 16:47:25 EDT 2006 | russ
very minimal at very few locations. We do not Xray every board but sample them. I think you will find pretty good results here (not perfect) Russ
Electronics Forum | Thu Oct 05 07:58:05 EDT 2006 | realchunks
I have noticed certain BGAs void more than others. We place about 8 different brands of BGAs and only one brand voids like crazy and we have to adjust for it.
Electronics Forum | Thu Oct 05 16:06:33 EDT 2006 | cw
Thanks! What's your ramp rate?2 - 3C/sec? What's your time above 217C. What's your peak temp?
Electronics Forum | Fri Oct 06 08:24:01 EDT 2006 | inds
CW, make sure your customer is aware of the affect high temp might have on adjacent components on the board. I guess you must have already checked out the rated temperature of all the components on the board
Electronics Forum | Fri Oct 06 08:21:26 EDT 2006 | inds
Mario, what happens when there are components on the boards that are not rated to take temperature of 230-240 C Peak for a mixed assembly. I guess there are tons of sn/Pb components that have rated temp of 225-230 C.. So in guess you might want
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