Sn42Bi57Ag1 Solder Paste NP505-LT lead-free soldering paste SMT Solder Paste Sn42Bi57Ag1 Solder Paste NP505-LT flux solder paste Product description: Sn42Bi57Ag1 Solder Paste NNP505-LT is a no-clean, Pb-free, zero-halogen solder paste for asse
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste for BGA refwork Product description: 100g Solder Paste for BGA refwork mobile phone repare &
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Industry News | 2008-02-29 16:42:42.0
ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.
Sn42Bi57Ag1 Solder Paste NP505-LT lead-free soldering paste SMT Solder Paste Sn42Bi57Ag1 Solder Paste NP505-LT flux solder paste Product description: Sn42Bi57Ag1 Solder Paste NNP505-LT is a no-clean, Pb-free, zero-halogen solder paste for asse
New Equipment | Solder Materials
We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Technical Library | 2021-09-08 14:10:12.0
The Pb-Free Alloy Characterization Program sponsored by International Electronics Manufacturing Initiative (iNEMI) is conducting an extensive investigation using accelerated temperature cycling (ATC) to evaluate ball grid array (BGA) thermal fatigue performance of 12 commercial or developmental Sn based Pb-free solder alloys. This paper presents the initial findings from a specific subset of the temperature cycling test matrix. The focus is on comparing alloy performance for two of the most commonly specified temperature cycles, 0 to 100 °C and -40 to 125 °C.
Industry News | 2011-10-16 00:20:48.0
Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.
