Full Site - : sn pb ag wettability (Page 1 of 33)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

Panasonic CM101 Y Axis Cable - Bear N510028368AA N510028367AA Cable Bear

Panasonic CM101 Y Axis Cable - Bear N510028368AA N510028367AA Cable Bear

Parts & Supplies | Assembly Accessories

CM101/CM202/CM20F/CM212/CM301/CM401/CM402/CM602/DT401 1.PanasonicCM402Spareparts Z-AXISbelt,NewPartNumber:N510030309AA,OldPartNumber:KXF0DWVHA00 Q-AXISbelt,NewPartNumber:N510030308AA KXFODKCAA00 KXFODKDAA00 KXFODKEAA00 KXFODKFAA00 KXFODKGAA00

KingFei SMT Tech

Solder Preforms and Pad Repair Kits

Solder Preforms and Pad Repair Kits

New Equipment | Solder Materials

We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.

CVInc.

Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging

Technical Library | 2013-10-17 17:46:01.0

Although several commercial and experimental Pb-free solder alloys are available as replacements for Sn-Pb solders, the following families of solders are of particular interest and are the prevailing choices of industry: eutectic Sn-Ag, eutectic Sn-Cu, eutectic Sn-Zn, eutectic Bi-Sn, and Sn–In. Since the properties of the binary Pb-free solders cannot fully meet the requirements for applications in electronic packaging, additional alloying elements are added to improve the performance of these alloys. Thus, ternary and even quaternary Pb-free solders have been developed, such as Sn-Ag-Cu, Sn-Ag-Bi, and Sn-Zn-Bi solder...

National Pingtung University of Science & Technology

AMTECH Premium Cast Bar Solder

AMTECH Premium Cast Bar Solder

New Equipment | Solder Materials

AMTECH’s Premium Bar Solder is designed to meet today’s sophisticated electronic manufacturing processes by providing a strong and reliable solder joint. All AMTECH bar solder is manufactured from a variety of high purity virgin metals that exceed th

AMTECH

Solder Spheres

Solder Spheres

New Equipment | Solder Materials

New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura

Indium Corporation

Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering

Ersa N-Wave 330

Ersa N-Wave 330

Used SMT Equipment | Soldering - Wave

The following Ersa N-Wave 330 has 2 full solder pots and various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is current just decommission

X-Line Asset Management

Alternative Pb-Free Alloys

Technical Library | 2011-08-25 17:47:23.0

While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about the high reflow temperatures of SAC or relies on ODM, it is im

DfR Solutions (acquired by ANSYS Inc)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2007-03-08 19:31:10.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.

Henkel Electronic Materials


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