Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel
hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro
Electronics Forum | Thu Aug 28 23:15:44 EDT 2014 | phyllishwl
Hi all, Our production reported that they found 3 panels out of 53 panels with strange phenomenon after reflow. 1/ Blister / Delamination of PCB panels, 2pcs blister/delamination under solder mask, 1pc under Gold plating at Gold finger 2/ Silkscr
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
