Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Industry News | 2016-10-11 19:22:52.0
KIC today announced that its distributor in Spain, Propelec, will represent the company at MATELEC, scheduled to take place Oct 25-28, 2016 in Madrid, Spain. Visit Hall 5 – Booth #5B03 & 5B05 to learn more about KIC’s X5 Profiler, automatic profiling, and smart oven technology.
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
Industry News | 2009-06-23 20:11:42.0
San Diego — June 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a free Webinar on June 26, 2009 at 1 p.m. PST. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
Industry News | 2017-09-28 15:07:29.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
Click here to view the SlimKIC 2000 datasheet Profiling So Easy, Anyone Can Do It By automating the complex task of process set up the SlimKIC® 2000™ makes profiling so easy that any operator can quickly achieve the optimal process. Simply select fro
