Career Center | Addison,Texas, Texas USA | Engineering
Need strong background in SMT Manufacturing Engineer new process qualification and provided engineer resolutions for production difficulties involving process and quality related issues, interface and provide process solutions to NPI project engineer
New Equipment | Education/Training
Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.
Industry News | 2022-01-07 06:44:54.0
Reliable temperature data is essential in today's fast-paced electronics manufacturing environment, but so too is equipment that is user-friendly. Solderstar has used their extensive knowledge and technical expertise to design the SLX, an innovative thermal profiler with the benefit of having zero measurement setup. Since its launch at the end of 2021, SLX has received much interest from the industry who can see the benefits of this novel profiling solution.
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
Industry News | 2012-10-11 19:38:41.0
KIC announces that its distributor in Spain and Portugal, Propelec, will highlight its new X5 Profiler and KIC RPI in Pavilion
Industry News | 2015-12-01 11:46:19.0
SolderStar joined industry experts from the electronics manufacturing sector to address the issues surrounding thermal profiling for today’s highly complex assemblies and discuss the way this impacts the manner in which the industry measures component temperatures accurately.
Industry News | 2009-06-30 09:33:19.0
San Diego — June 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m. PDT in response to the overwhelming turnout to this Webinar when previously presented. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
Industry News | 2009-06-30 09:33:30.0
San Diego — June 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O’Leary, Sales Manager – Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m. PDT in response to the overwhelming turnout to this Webinar when previously presented. The topic of the Webinar will focus on providing solutions to common thermal process and profiling issues.
Technical Library | 2010-08-26 21:06:17.0
Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide. Recalls are costly and time-consuming events that should be avoided entirely. But without adequate process traceability and product genealogy, too many customers will get defective products and too many products will be recalled for repair or replacement even though they are not defective. Both scenarios have enormous implications for the quality-conscious manufacturer that gets rated on the number of recalls it performs - not to mention the enormous direct costs. The core issue is visibility into product quality.
Technical Library | 2015-04-16 16:11:43.0
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...) In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement.
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