Full Site - : sn100c profile issues (Page 4 of 147)

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

High Reliability Lead-free Solder SN100C?Sn-0.7Cu-0.05Ni?Ge?

Technical Library | 2008-03-31 21:35:36.0

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.

Nihon Superior Co., Ltd.

Nihon Superior Debuts Selector Guide for SN100C Solder Pastes

Industry News | 2011-09-28 19:37:44.0

Nihon Superior introduces the new Selector Guide for SN100C solder pastes.

Nihon Superior Co., Ltd.

SN100C-XF3+ Lead-free Solder Paste

SN100C-XF3+ Lead-free Solder Paste

New Equipment | Solder Materials

Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the

Cobar Solder Products Inc.

SN100C - Lead-Free Solder Alloy

SN100C - Lead-Free Solder Alloy

New Equipment | Solder Materials

SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages

AIM Solder

Nihon Superior to Display Complete Range of SN100C Soldering Materials at SMTA International 2008

Industry News | 2008-08-07 15:26:07.0

Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.

Nihon Superior Co., Ltd.

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.


sn100c profile issues searches for Companies, Equipment, Machines, Suppliers & Information

Win Source Online Electronic parts

Reflow Soldering 101 Training Course
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.


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