Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch
This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!
Electronics Forum | Tue Mar 20 06:09:20 EDT 2007 | d0min0
Hi, can't find answer to my question on web - maybe someone can help would it be compatible to use a wire of Sn62Pb36Ag2 for a product made with Sn63Pb37 paste ??? regards
Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Sun Nov 04 01:04:04 EST 2007 | omidjuve
we are manufacturing some rf boards that works on a high frequency margins now our boards doesn't pass in impedance test and we concluded that the problem might cause by the solder paste that we are using . our solder alloy is sn62/pb36/ag2 and we t
Electronics Forum | Wed Feb 20 09:38:47 EST 2002 | davef
Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc re: "Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ?" No Several points are: * Component leads with silver in the sol
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Tue Apr 26 07:56:12 EDT 2016 | joelperez
Hello SMTnet team, I have read before that silver content on solder joints is ok at around 2% total silver content. Does anyone has experience using SN62/PB36/AG2 BGAs on hard gold (10 micro inches) PCB surface finish? Any drawbacks? Thanks Joel
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve
we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th
