Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Mon Jan 11 18:54:35 EST 1999 | Dean
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | I have seen this be
Electronics Forum | Tue Jan 20 06:38:06 EST 1998 | Igmar
Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this com
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Tue May 09 18:30:35 EDT 2006 | muse95
I can understand the theory behind fewer tombstones with SAC. If people were having tombstone problems with SnPb eutectic solder, often switching to Sn62Pb36Ag2 would improve it, because with the addition of some silver, a small plastic zone in the
Electronics Forum | Tue Nov 30 18:02:45 EST 2010 | flipit
62/36/2 is used often in thickfilm hybrid circuits where Pd/Ag conductors are used. The idea is that you saturate the joint with the 2% silver and thus help eliminate the leaching of the silver from the hybrid circuit pads or the component. We mix
Electronics Forum | Mon Apr 01 17:20:45 EDT 2013 | davef
In thinking about troubleshooting tombstoning {TS} defects, seek balance: * Pads the same size * Same amount of paste on each pad * Component placed with the same amount of contact on each pad * Heating the same on each pad, no via connection to a gr
