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AMTECH BGA Solder Spheres

AMTECH BGA Solder Spheres

New Equipment | Solder Materials

AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N

AMTECH

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

Tombstone defect

Electronics Forum | Tue May 06 22:31:52 EDT 2003 | yukim

Yes, we did try: built a lot of 200 PCBs with Sn62Ag2 solder paste (we have been using Sn63) and it helped, but not eliminated the problem.

Sn62Pb36Ag2

Electronics Forum | Thu Dec 02 07:40:54 EST 2010 | scottp

2000 cycles of -40/+150C thermal cycling.

Sn62Pb36Ag2

Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip

1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 09:12:59 EDT 2006 | pavel_murtishev

Good afternoon, Profile is standard ramp-soak-spike (According to paste manufacturer requirements), paste is Almit V16L HM1-RMA, type 3, Sn62Ag2. Look here for details: http://www.yousendit.com/transfer.php?action=download&ufid=98684D1201B0F001

BGA solder ball composition

Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef

Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �

Re: 2%Ag?

Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F

| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used

Tombstoning issues!!!

Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip

Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer

2%Ag?

Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch

This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!


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