Electronics Forum | Thu Oct 14 17:10:37 EDT 2010 | hegemon
Heck, now I look up and see this is SMTdotNET. Do I get banned for asking a TH question? So here's my first real TH issue after living so long in the SMT world. We are having a sudden issue in what has been a stable process for quite some time. I
Electronics Forum | Mon May 09 16:44:33 EDT 2011 | dcell_1t
Hi, We have been struggling with an issue of non wetting on a QFP (Renesas - 256, Sn90Pb10) but the issue "desapears" sometimes for a while and then back again suddenly. This is the scenario: Component: QFP 256 / Renesas / Sn90Pb10 / 0.5 mm pitch S
Electronics Forum | Mon Oct 12 10:26:52 EDT 2015 | eniac
My greetings to all. Time to time I receive the next results of modems soldering: http://i.piccy.info/i9/71ae4c358c6e4bc3f1cbf140495bc437/1444660170/135005/872954/GL868_7.jpg or http://i.piccy.info/i9/d1181be142e285a39b49b81d37bde72a/1444660270/1
Electronics Forum | Thu Apr 22 17:19:57 EDT 1999 | JohnW
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef
Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to
Electronics Forum | Thu Dec 06 12:37:14 EST 2012 | deanm
We are having difficulty with bridging on a 2x50 pin 0.050" fine pitch connector using our selective soldering machine. It usually bridges at the end of the row, but sometimes it bridges all the pins together as it drags across (solid bridging). I
Electronics Forum | Fri Jul 06 12:07:07 EDT 2001 | nwyatt
I have been researching lead-free paste for a while now and I will share with you what I can. Firstly, SnAgCu seems to be the common industry choice. It really depends on your application - the cell phone/pda sector is primarly using different comb
Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW
| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu
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