Full Site - : sn63pb37 (Page 6 of 15)

Sn99 Cu0.7 Ag 0.3

Electronics Forum | Tue Mar 08 08:28:12 EST 2005 | py (france)

a french subcontractor had tried this alloy for a show (in france). I was here , the PCB was not to hard to weld , but the results were not as good than Sn63pb37.(of course) the advantage is the price. see cookson for details.....

SnPb reworked with SnPbAg ?

Electronics Forum | Tue Mar 20 06:09:20 EDT 2007 | d0min0

Hi, can't find answer to my question on web - maybe someone can help would it be compatible to use a wire of Sn62Pb36Ag2 for a product made with Sn63Pb37 paste ??? regards

soldering ROHS boards with sn/pb components

Electronics Forum | Wed Aug 27 11:25:11 EDT 2008 | blnorman

We use immersion tin boards and ENIG with Sn63Pb37 with no problems. We did have to tweak the profile higher with ImmSn though.

Rohs finish with lead past

Electronics Forum | Tue Dec 02 13:01:11 EST 2008 | floydf

Does anyone know if it possible to use Sn63/Pb37 paste on a board with Sn100 finish. Any thoughts on this will be greatly appreciated.

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 17:43:53 EDT 2012 | scottv02

I have heard there is a process for mitigating the pure tin issues for 0402/0201 size parts by the use of SN63/PB37 solder print process. Is this true and does anyone have the data to back this up?

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Wed Feb 14 02:08:40 EST 2018 | ameenullakhan

Hi Sweetoldbob, Thanks. We are using SMQ92J solder paste ( Sn63/Pb37 ). We are on higher side of reflow time for leaded paste. Regards, Ameen

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 24 10:07:44 EDT 2019 | ameenullakhan

Hi Team, Can anyone suggest me best stencil opening for CCGA. Attached is the component details. Solder paste : water solube - ORL0 - Jtsd 001 ( Sn63/Pb37) Any one has qualified the same. Regards, Ameen

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Tue Jun 07 19:24:26 EDT 2005 | Joseph

Dear all, Recently we encountered some functionality failure when using lead-free component(Sn99.3/Cu0.7)at SnPb(Sn63Pb37) wave soldering process. Can lead-free component use at non-lead free process? Any input/idea are much appreciated. Rgds

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

solder paste profiles

Electronics Forum | Thu Feb 24 16:08:54 EST 2000 | Gary

I have the situation where we may need to use a variety of reflow temperatures. It seems that the design engineers want us to try a variety of "unspecified" pastes on the products. For example, the first PCB would be assembled using a higher temperat


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