Full Site - : sn63pb37 (Page 6 of 14)

Sn63Pb37 on RoHS compliant PWB

Electronics Forum | Thu Apr 12 17:34:05 EDT 2007 | carsan

We are running RoHS compliant & non RoHS compliant assemblies. We buy our bare boards from one supplier that only manufactures RoHS compliant boards using a Sn100 finish. Is there any known issues running leaded solder on a Tin finish? Does normal

Could use some help

Electronics Forum | Fri May 18 10:56:09 EDT 2007 | patrickbruneel

Hi smtnetters, I�m looking for reference material preferably graph�s displaying the viscosity and surface tension vs. temperature for standard Sn63 Pb37 alloy. Plenty of reference material is available on pure metals but can�t find anything on the

Is solder purity affect solder joint reliability?

Electronics Forum | Mon Jul 14 07:49:50 EDT 2008 | edmaya33

Do we really need to follow the IPC J-STD-001 Solder purity? If so, how to effectively balance the chemistry of Sn63/Pb37 other than adding a pure tin on the solder bath? Is this really needed to monitor in monthly basis?How many kgs of pure tin pe

I need 15 - 25 microns (T5) Solder Paste

Electronics Forum | Wed Jan 05 17:56:30 EST 2011 | ppcbs

I am looking for a No-clean or water soluble solder paste, Sn63/Pb37 alloy, 15 - 25 microns (T5). I need to print with a 4.8 mil stencil opening. Does anyone know where I can get 250 to 500 grams in one week or less?

Component ( Connector ) drop during secondary reflow

Electronics Forum | Mon Dec 03 03:58:24 EST 2018 | ameenullakhan

Hi , Observed component drop during second reflow. Component : Image attached Perimeter : 0.15 to 0.025 cm No of leads : 22 Solder Alloy : Sn63/Pb37 As per component adhesion calculation the component should not fall. ( Excel Attached ) Profile

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax

I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo

Using Sn60/Pb40 on Sn63/Pb37 Rework

Electronics Forum | Tue Sep 13 02:51:35 EDT 2022 | sarason

Lead and tin form a eutectic solution. So no to that one, as to breaking some rule or other other people who are far more knowledgeable than me on "the rules" could pipe in. Also tin/lead eutectics don't grow tin whiskers like a lot of the replacemen

Re: Double sided smt

Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik

Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting

Re: Oven Temperature for Solder Reflow

Electronics Forum | Wed Aug 04 18:57:26 EDT 1999 | Dreamsniper

| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | Hi Judy, In profiling you need an understanding of the reflow specs from the solder paste manufacturer then you nee

Re: Oven Temperature for Solder Reflow

Electronics Forum | Wed Aug 04 22:35:32 EDT 1999 | ScottM

| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | D... is correct -- it's all dependent on your paste and your oven. Call your paste supplier (each one has a technica


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