Industry Directory: sn63pb37 (1)

AIM Solder

Industry Directory | Manufacturer

AIM is a leading global manufacturer of solder assembly materials for the electronics industry.

New SMT Equipment: sn63pb37 (7)

Sn63/Pb37 Electropure™ High Purity Solder Alloy

Sn63/Pb37 Electropure™ High Purity Solder Alloy

New Equipment | Solder Materials

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solde

AIM Solder

Qualitek 670I No-Clean Leaded Solder Paste

Qualitek 670I No-Clean Leaded Solder Paste

New Equipment | Solder Materials

Made for high speed leaded assembly. No Clean Solder Paste, Alloy: Sn63/Pb37, Type 3 Powder -325+500, 250 gram jar. Buy one or two jars on line. While supplies last.

solderstoreonline.com

Electronics Forum: sn63pb37 (104)

Using Sn60/Pb40 on Sn63/Pb37 Rework

Electronics Forum | Mon Sep 12 15:04:50 EDT 2022 | arminski

Will there be solder joint integrity issues if in Using Sn60/Pb40 on Sn63/Pb37 processed PCB during Rework? Thank you

AIM, KESTER, OR INDIUM PASTE PREFERRED?

Electronics Forum | Fri Oct 28 06:46:11 EDT 2005 | james

We used AIM water Soluble Sn63/Pb37 and it tend to be very tacky.

Used SMT Equipment: sn63pb37 (5)

Vitronics Soltec Delta 5 6622CC

Vitronics Soltec Delta 5 6622CC

Used SMT Equipment | Soldering - Wave

Operating System:  Windows based Details: •        Dual pot-Lead and Lead Free •        Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder •        Carbon Steel Solder pots with high temperature protective coating •        A

Lewis & Clark

Technical Devices NU/ERA 16MP

Technical Devices NU/ERA 16MP

Used SMT Equipment | Soldering - Wave

Technical Devices NU/ERA 16MP (EXCELLENT CONDITION) L and V fingers Internal 9500 spray fluxer dual wave Full of Sn63/Pb37 solder finger cleaner top side tunnel roll out solder pot Like new condition  

TDS

Industry News: sn63pb37 (9)

SMT reflow oven process principle and introduction

Industry News | 2018-10-18 09:42:39.0

SMT reflow oven process principle and introduction

Flason Electronic Co.,limited

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

Technical Library: sn63pb37 (2)

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Technical Library | 2007-11-15 15:54:44.0

At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.

Kester

Rework Stations: Meeting the Challenges of Lead-Free Solders

Technical Library | 2015-02-12 13:32:52.0

Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.

Cupio Yestech Europe

Express Newsletter: sn63pb37 (4)

Partner Websites: sn63pb37 (9)

SMT reflow oven process principle and introduction-SMT Technical-Reflow oven,SMT Reflow Soldering Ov

| http://etasmt.com/cc?ID=te_news_industry,24162&url=_print

is no qualitative change. the key of lead-free  is  in the   reflow   oven. The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1

Heller Industries Inc.


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