Used SMT Equipment | In-Circuit Testers
Agilent-Keysight E4412A The Agilent E4412A diode power sensor, with wide dynamic range, is designed for use with the EPM and EPM-P series power meters for power measurements on CW signals from 10 MHz to 18 GHz. The E4412A power sensor provides ex
Sensirion presents the world with the first digital humidity and temperature sensor. The tiny SMD sensor module (mass: 7.5 x 5 x 2.5mm, Lx W x H) transmits a calibrated digital signal to measure the relative humidity and temperature. In addition, ow
Sensirion presents the world with the first digital humidity and temperature sensor. The tiny SMD sensor module (mass: 7.5 x 5 x 2.5mm, Lx W x H) transmits a calibrated digital signal to measure the relative humidity and temperature. In addition, ow
Harwin’s Gecko (G125 series) connectors provide a low profile, dual row cable-to-board and board-to-board interconnect solution, ideally suited for stacking and cable mating in areas where PCB real estate is at a premium. For more information and sa
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight E4412A The Agilent E4412A diode power sensor, with wide dynamic range, is designed for use with the EPM and EPM-P series power meters for power measurements on CW signals from 10 MHz to 18 GHz. The E4412A power sensor provides ex
Technical Library | 2024-01-08 18:36:01.0
The following aims lie behind the investigations described: The circuit board is an integrated structure made of metal and plastic. Like most integrated components enclosed in plastic, it absorbs water. When it is rapidly heated as, for example, in soldering technology temperature processes, it is a well known fact that the water will evaporate abruptly, leading to destruction. It is therefore essential that the circuit board be dried before these soldering processes. Circuit board manufacturers are extremely hesitant at providing instructions on drying their circuit boards. Information from the ZVEI [1] should also be regarded critically. The cardinal problem is the high temperature which is recommended for baking. If this is applied, the result is often de-lamination and distortion of the circuit boards. Corrosion and the formation of intermetallic phases of the metallic surfaces are also to be expected. The following investigates whether gentle drying at 45°C or 60°C and at low relative humidity achieves the same result as baking at high temperatures. The industry provides novel dry cabinets which are suitable for rapid drying at relative humidities below one percent.
Designed to exceed the harsh environment requirements that are seen in applications used in electronics, electrical, automotive and aerospace. All materials are thermal transfer printable and exhibit the highest PCS and first read rates.Each label
Higher throughput reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT reflow oven utilizes our patented Horizontal Convection Heating technology for extremely uniform temperature profiling across the board for enhanced process
http://www.ddmnovastar.com/reflow-ovens Reflow oven products, including batch reflow ovens, benchtop reflow ovens, and floor standing production models, for lead-free and lead based reflow soldering, curing, and thermal cycling applications.
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
