Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2016-01-20 10:43:07.0
With “Securo”, Rehm Thermal Systems offers a new series for reliable hot and cold function tests Electronic components in safety-relevant applications such as medical, automotive and aerospace technology must function 100 % reliably under all temperature conditions. To analyse the reliability of electronics under extreme temperatures, Rehm Thermal Systems has developed a completely new series: Securo Plus for hot function tests and Securo Minus for cold function tests. The systems can simulate precisely these extreme environmental conditions by selectively heating or cooling the component.
New Equipment | Soldering Robots
The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring a
Industry News | 2022-04-13 10:04:24.0
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2023-08-14 12:12:00.0
SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
Low Cost SMT Reflow Oven A8 SMT Reflow Oven Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: Low Cost SMT Reflow Oven A8, SMT Reflow Oven, Heating zones: 8, Heating method: Hot Air, Usage: SMT Assembly lin
Low Cost SMT Reflow Oven A8 Name: SMT Reflow Oven Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: Low Cost SMT Reflow Oven A8 INQUIRY Low Cost SMT Reflow Oven A8 Product Specifications:
For Immediate Release For Further Information Contact: Rick Sandlas, Power PR Phone: (310) 787-1940 Fax: (310) 787-1970 E-mail: Power@ix.netcom.com SaRonix Announces Industry's First 1.8 Volt Crystal Clock Oscillator Newly available NTH Series all
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